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---
tags:
- school
- 文献
---
# 十五篇
## 中文
- 苏良碧.高速PCB电源完整性设计与分析[D].内蒙古大学,2011.
- 张绍军,黄振.高速数字系统中的信号完整性及实施方案[J].电子技术应用,2002,(11):31-33.DOI:10.16157/j.issn.0258-7998.2002.11.010.
- 方丹.高速数字系统中有耗传输与噪声抑制的研究[D].中国科学技术大学,2022.DOI:10.27517/d.cnki.gzkju.2022.001016.
- 温舒桦.高速数字系统的电源分配网络与结构性辐射发射研究[D].北京邮电大学,2017.
- 张松松.高速电路板级SI、PI、EMI设计[D].西安电子科技大学,2013.
- 饶露.高速数字电路设计中信号完整性和电源完整性的仿真和应用[D].武汉邮电科学研究院,2012.
- 曹世伟.高速电路中的信号完整性和电源完整性研究[D].西安电子科技大学,2015.
- 姜攀.板级信号完整性、电源完整性和电磁干扰研究[D].内蒙古大学,2015.
- 陈放,田建宇,孙兆牛,等.基于信号完整性与电源完整性的PCB电磁兼容协同仿真方法研究[J].航天控制,2017,35(04):90-94.DOI:10.16804/j.cnki.issn1006-3242.2017.04.017.
- 侯永彬,王志成.高速电路板电源完整性问题分析及解决方案[J].信息通信,2020,(05):94-95.
- 胡安琪,查云飞.基于信号完整性和电源完整性的PCB电磁兼容仿真[J].汽车文摘,2025,(04):48-55.DOI:10.19822/j.cnki.1671-6329.20240196.
- 胡华清.高速数字系统中电源噪声抑制的研究[D].西安电子科技大学,2017.
## 英文
- Choi Y K, Cho S G, Park M S, et al. SI/PI/EMI analysis of through-via effects on power/ground plane using high dielectric material[C]//2007 9th Electronics Packaging Technology Conference. IEEE, 2007: 425-428.
- Duan X, Rimolo-Donadio R, Brüns H D, et al. Fast and concurrent simulations for SI, PI, and EMI analysis of multilayer printed circuit boards[C]//2010 Asia-Pacific International Symposium on Electromagnetic Compatibility. IEEE, 2010: 614-617.
- Xiong Y, Yan Z. EMI and PI analysis of analog board[C]//2013 5th IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications. IEEE, 2013: 171-175.